Wafer Thickness Inspection Workstation

Function：

• Adopts laser detection sensing system to detect the thickness of wafers, with a measurement accuracy of 0.1um.
• Relying on the advanced spectral interferometer detection system, it can obtain the thickness data of the largest diameter 300mm Wafer, compatible with the Sorter function, realizing the multi-purpose use of one machine.

Features：

• Can test Wafer and substrate with rough surface.
• Adopting X/Y linear module moving platform, it can quickly locate the required test points and test the thickness with high precision, and the test is fast, scanning 30-60 times per second.
• Users can set up their own points for testing.
• The system is equipped with a high-precision, long-life moving platform to ensure the long-term stability of the factory's production needs.
• According to customer demand non-standard customized equipment products with optimal configuration.