8-inch wafer geometry tool

Testing method: wavelength tuning (frequency conversion) interference test

Suitable for: φ150-300mm (6-12") wafer

Test parameters: Bow, Warp, TTV, etc.

Test accuracy: 100nm

Test resolution: 2048×2048 pexil

Testing efficiency: 60s/sheet

Analyzing function:

• Grid division (cell size optional);
• Single grid parameter output;
• Test result evaluation;
• Full-caliber parameter output:
• Output test report; 

Test benchmarking:

• American Coning MSP
• U.S. KLA tester